Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked die module and techniques for forming a stacked die module

Stacked die module and techniques for forming a stacked die module

US Patent 7029931 · Granted Apr 18, 2006

Estimated economic value: $2,761,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Techniques for packaging multiple device components2017
Semiconductor device structures and electronic devices including hybrid conducti2014
Semiconductor device including one or more stiffening elements2014
Techniques for packaging multiple device components2014
Methods of fabrication of package assemblies for optically interactive electroni2014
Advanced detection of memory device removal, and methods, devices and connectors2013
Electronic devices2013
Methods of fabrication of package assemblies for optically interactive electroni2013
Semiconductor device structures and electronic devices including same hybrid con2013
Techniques for packaging multiple device components2012
Advanced detection of memory device removal, and methods, devices and connectors2012
Narrow band receiver2012