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Method and system for electrically coupling a chip to chip package |
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Method and system for electrically coupling a chip to chip package |
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System and method for multiple bit optical data transmission in memory systems |
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Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods |
Timothy L. Jackson |
2008-04-08 |
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Method and system for electrically coupling a chip to chip package |
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2008-02-26 |
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System and method for multiple bit optical data transmission in memory systems |
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2007-08-07 |
| 7015559 |
Method and system for electrically coupling a chip to chip package |
Lee Gotcher |
2006-03-21 |
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Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof |
Timothy L. Jackson |
2005-11-08 |
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Method and system for electrically coupling a chip to chip package |
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2005-08-30 |
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Method and system for electrically coupling a chip to chip package |
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2004-12-14 |
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Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies |
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2004-10-05 |
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