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USPTO Patent Rankings Data through Dec 31, 2025
TM

Tim Murphy — 15 Patents

Micron: 12 patents #1,284 of 6,374Top 25%
STStoneridge: 2 patents #14 of 63Top 25%
Boise, ID: #609 of 3,546 inventorsTop 20%
Idaho: #919 of 8,810 inventorsTop 15%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Tim Murphy has been granted 15 US patents while listed as an inventor at Micron. The first was granted in 1983 and the most recent in April 2016. Tim Murphy ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Tim Murphy in Boise, ID, US.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
9305861 Method and system for electrically coupling a chip to chip package Lee Gotcher 2016-04-05 $6,062,000
8866012 Sensor lead sealing and strain relief Brian Engelbach, Robert J. Sparks, Jeffrey T. Norris, Michael L. Heston 2014-10-21 $2,383,000
8338702 Sensor lead sealing and strain relief Brian Engelbach, Robert J. Sparks, Jeffrey T. Norris, Michael L. Heston 2012-12-25
8072037 Method and system for electrically coupling a chip to chip package Lee Gotcher 2011-12-06 $2,259,000
7732882 Method and system for electrically coupling a chip to chip package Lee Gotcher 2010-06-08 $4,882,000
7489875 System and method for multiple bit optical data transmission in memory systems 2009-02-10 $1,650,000
7355273 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods Timothy L. Jackson 2008-04-08 $2,204,000
7335985 Method and system for electrically coupling a chip to chip package Lee Gotcher 2008-02-26 $1,909,000
7254331 System and method for multiple bit optical data transmission in memory systems 2007-08-07 $1,952,000
7015559 Method and system for electrically coupling a chip to chip package Lee Gotcher 2006-03-21 $2,245,000
6962867 Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof Timothy L. Jackson 2005-11-08 $2,956,000
6936489 Method and system for electrically coupling a chip to chip package Lee Gotcher 2005-08-30 $1,004,000
6831301 Method and system for electrically coupling a chip to chip package Lee Gotcher 2004-12-14 $1,542,000
6800930 Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies Timothy L. Jackson 2004-10-05 $2,061,000
4397701 Method of making masks Sander K. Johnson, Dean Hensley, Ronald Sallon 1983-08-09