Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9305861 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2016-04-05 |
| 8866012 | Sensor lead sealing and strain relief | Brian Engelbach, Robert J. Sparks, Jeffrey T. Norris, Michael L. Heston | 2014-10-21 |
| 8338702 | Sensor lead sealing and strain relief | Brian Engelbach, Robert J. Sparks, Jeffrey T. Norris, Michael L. Heston | 2012-12-25 |
| 8072037 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2011-12-06 |
| 7732882 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2010-06-08 |
| 7489875 | System and method for multiple bit optical data transmission in memory systems | — | 2009-02-10 |
| 7355273 | Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods | Timothy L. Jackson | 2008-04-08 |
| 7335985 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2008-02-26 |
| 7254331 | System and method for multiple bit optical data transmission in memory systems | — | 2007-08-07 |
| 7015559 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2006-03-21 |
| 6962867 | Methods of fabrication of semiconductor dice having back side redistribution layer accessed using through-silicon vias and assemblies thereof | Timothy L. Jackson | 2005-11-08 |
| 6936489 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2005-08-30 |
| 6831301 | Method and system for electrically coupling a chip to chip package | Lee Gotcher | 2004-12-14 |
| 6800930 | Semiconductor dice having back side redistribution layer accessed using through-silicon vias, and assemblies | Timothy L. Jackson | 2004-10-05 |
| 4397701 | Method of making masks | Sander K. Johnson, Dean Hensley, Ronald Sallon | 1983-08-09 |