Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for electrically coupling a chip to chip package

Method and system for electrically coupling a chip to chip package

US Patent 7335985 · Granted Feb 26, 2008

Estimated economic value: $1,909,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method and system for electrically coupling a chip to chip package2016
Method and system for electrically coupling a chip to chip package2016
Sensor lead sealing and strain relief2014
Sensor lead sealing and strain relief2012
Method and system for electrically coupling a chip to chip package2011
Method and system for electrically coupling a chip to chip package2011
Method and system for electrically coupling a chip to chip package2010
Method and system for electrically coupling a chip to chip package2010
System and method for multiple bit optical data transmission in memory systems2009
Semiconductor dice having back side redistribution layer accessed using through-2008
System and method for multiple bit optical data transmission in memory systems2007
Method and system for electrically coupling a chip to chip package2006