Issued Patents All Time
Showing 26–50 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7423331 | Molded stiffener for thin substrates | Cary J. Baerlocher | 2008-09-09 |
| 7419854 | Methods for packaging image sensitive electronic devices | Todd O. Bolken | 2008-09-02 |
| 7399657 | Ball grid array packages with thermally conductive containers | Todd O. Bolken | 2008-07-15 |
| 7387902 | Methods for packaging image sensitive electronic devices | Todd O. Bolken | 2008-06-17 |
| 7332376 | Method of encapsulating packaged microelectronic devices with a barrier | — | 2008-02-19 |
| 7326316 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2008-02-05 |
| 7288431 | Molded stiffener for thin substrates | Cary J. Baerlocher | 2007-10-30 |
| 7275676 | Apparatus for locating conductive spheres utilizing screen and hopper of solder balls | Michael B. Ball, Marjorie L. Waddel | 2007-10-02 |
| 7239029 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2007-07-03 |
| 7227252 | Semiconductor component having stacked, encapsulated dice and method of fabrication | Todd O. Bolken | 2007-06-05 |
| 7217596 | Stacked die module and techniques for forming a stacked die module | Timothy L. Jackson | 2007-05-15 |
| 7195940 | Methods for packaging image sensitive electronic devices | Todd O. Bolken | 2007-03-27 |
| 7186576 | Stacked die module and techniques for forming a stacked die module | Timothy L. Jackson | 2007-03-06 |
| 7179681 | Techniques for packaging multiple device components | Todd O. Bolken | 2007-02-20 |
| 7169645 | Methods of fabrication of package assemblies for optically interactive electronic devices | Todd O. Bolken | 2007-01-30 |
| 7144245 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2006-12-05 |
| 7134390 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2006-11-14 |
| 7122404 | Techniques for packaging a multiple device component | Todd O. Bolken | 2006-10-17 |
| 7109576 | Semiconductor component having encapsulated die stack | Todd O. Bolken | 2006-09-19 |
| 7105366 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2006-09-12 |
| 7105432 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Michael B. Ball, Marjorie L. Waddel | 2006-09-12 |
| 7101737 | Method of encapsulating interconnecting units in packaged microelectronic devices | — | 2006-09-05 |
| 7101730 | Method of manufacturing a stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2006-09-05 |
| 7091060 | Circuit and substrate encapsulation methods | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2006-08-15 |
| 7074648 | Method for packaging flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2006-07-11 |