Issued Patents All Time
Showing 76–100 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6853064 | Semiconductor component having stacked, encapsulated dice | Todd O. Bolken | 2005-02-08 |
| 6844216 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Michael B. Ball, Marjorie L. Waddel | 2005-01-18 |
| 6838760 | Packaged microelectronic devices with interconnecting units | — | 2005-01-04 |
| 6798057 | Thin stacked ball-grid array package | Todd O. Bolkin | 2004-09-28 |
| 6793749 | Automated method of attaching flip-chip devices to a substrate | Rich Fogal, John VanNortwick | 2004-09-21 |
| 6777071 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2004-08-17 |
| 6778404 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2004-08-17 |
| 6773523 | Automated method of attaching flip chip devices to a substrate | Rich Fogal, John VanNortwick | 2004-08-10 |
| 6750070 | Process for manufacturing flip-chip semiconductor assembly | John VanNortwick, Bret K. Street, Tongbi Jiang | 2004-06-15 |
| 6709896 | Methods for use in packaging applications using an adhesive composition | Tongbi Jiang, Edward A. Schrock | 2004-03-23 |
| 6699928 | Adhesive composition for use in packaging applications | Tongbi Jiang, Edward A. Schrock | 2004-03-02 |
| 6689635 | Apparatus and method for face-to-face connection of a die to a substrate with polymer electrodes | Tongbi Jiang | 2004-02-10 |
| 6682955 | Stacked die module and techniques for forming a stacked die module | Timothy L. Jackson | 2004-01-27 |
| 6669781 | Method and apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-12-30 |
| 6660558 | Semiconductor package with molded flash | Todd O. Bolken, David L. Peters, Patrick W. Tandy | 2003-12-09 |
| 6646354 | Adhesive composition and methods for use in packaging applications | Tongbi Jiang, Edward A. Schrock | 2003-11-11 |
| 6641669 | Method and apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-11-04 |
| 6607599 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-08-19 |
| 6599365 | Apparatus for improving stencil/screen print quality | Tongbi Jiang, John VanNortwick | 2003-07-29 |
| 6595408 | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement | Michael B. Ball, Marjorie L. Waddel | 2003-07-22 |
| 6584897 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2003-07-01 |
| 6572444 | Apparatus and methods of automated wafer-grinding using grinding surface position monitoring | Michael B. Ball | 2003-06-03 |
| 6559537 | Ball grid array packages with thermally conductive containers | Todd O. Bolken | 2003-05-06 |
| 6558600 | Method for packaging microelectronic substrates | Vernon Williams | 2003-05-06 |
| 6551917 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Michael B. Ball, Marjorie L. Waddel | 2003-04-22 |