Issued Patents All Time
Showing 101–123 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6545498 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2003-04-08 |
| 6537400 | Automated method of attaching flip chip devices to a substrate | Rich Fogal, John VanNortwick | 2003-03-25 |
| 6533159 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Michael B. Ball, Marjorie L. Waddel | 2003-03-18 |
| 6521287 | Method for manufacturing improved stencil/screen | Tongbi Jiang, John VanNortwick | 2003-02-18 |
| 6518654 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2003-02-11 |
| 6501157 | Substrate for accepting wire bonded or flip-chip components | — | 2002-12-31 |
| 6472901 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2002-10-29 |
| 6440777 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Tongbi Jiang, John VanNortwick | 2002-08-27 |
| 6427587 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2002-08-06 |
| 6368897 | Method for manufactoring and using stencil/screen | Tongbi Jiang, John VanNortwick | 2002-04-09 |
| 6369602 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2002-04-09 |
| 6353268 | Semiconductor die attachment method and apparatus | Tongbi Jiang, Ed A. Schrock | 2002-03-05 |
| 6343019 | Apparatus and method of stacking die on a substrate | Tongbi Jiang | 2002-01-29 |
| 6331221 | Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member | — | 2001-12-18 |
| 6331453 | Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities | Todd O. Bolken, David L. Peters, Patrick W. Tandy | 2001-12-18 |
| 6329220 | Packages for semiconductor die | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2001-12-11 |
| 6329832 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2001-12-11 |
| 6269742 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2001-08-07 |
| 6268275 | Method of locating conductive spheres utilizing screen and hopper of solder balls | Michael B. Ball, Marjorie L. Waddel | 2001-07-31 |
| 6238223 | Method of depositing a thermoplastic polymer in semiconductor fabrication | Tongbi Jiang, John VanNortwick | 2001-05-29 |
| 6184064 | Semiconductor die back side surface and method of fabrication | Tongbi Jiang | 2001-02-06 |
| 6089151 | Method and stencil for extruding material on a substrate | Ford B. Grigg | 2000-07-18 |
| 6064120 | Apparatus and method for face-to-face connection of a die face to a substrate with polymer electrodes | Tongbi Jiang | 2000-05-16 |