Issued Patents All Time
Showing 51–75 of 123 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7049685 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices | Stephen James | 2006-05-23 |
| 7029931 | Stacked die module and techniques for forming a stacked die module | Timothy L. Jackson | 2006-04-18 |
| 7026548 | Moisture-resistant electronic device package and methods of assembly | Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler | 2006-04-11 |
| 7019408 | Stackable ball grid array | Todd O. Bolken, Cary J. Baerlocher, David J. Corisis | 2006-03-28 |
| 7008822 | Method for fabricating semiconductor component having stacked, encapsulated dice | Todd O. Bolken | 2006-03-07 |
| 7005878 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2006-02-28 |
| 6995462 | Image sensor packages | Todd O. Bolken | 2006-02-07 |
| 6982177 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2006-01-03 |
| 6979595 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices | Stephen James | 2005-12-27 |
| 6972200 | Method for manufacturing flip-chip semiconductor assembly | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-12-06 |
| 6967113 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-11-22 |
| 6965160 | Semiconductor dice packages employing at least one redistribution layer | Jerry M. Brooks | 2005-11-15 |
| 6962826 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-11-08 |
| 6957760 | Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux | Michael B. Ball, Marjorie L. Waddel | 2005-10-25 |
| 6954081 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-10-11 |
| 6953699 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-10-11 |
| 6953700 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-10-11 |
| 6953891 | Moisture-resistant electronic device package and methods of assembly | Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler | 2005-10-11 |
| 6951684 | Electrical interconnect using locally conductive adhesive | Steve W. Heppler | 2005-10-04 |
| 6949943 | Method for in-line testing of flip-chip semiconductor assemblies | John VanNortwick, Bret K. Street, Tongbi Jiang | 2005-09-27 |
| 6906403 | Sealed electronic device packages with transparent coverings | Todd O. Bolken | 2005-06-14 |
| 6897096 | Method of packaging semiconductor dice employing at least one redistribution layer | Jerry M. Brooks | 2005-05-24 |
| 6861345 | Method of disposing conductive bumps onto a semiconductor device | Michael B. Ball | 2005-03-01 |
| 6856009 | Techniques for packaging multiple device components | Todd O. Bolken | 2005-02-15 |
| 6853058 | Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member | — | 2005-02-08 |