Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12380592 | Image processing system and method | Kentaro WADA, Edgar Antonio Sucar Escamilla, Daniel James Lenton, Andrew Davison | 2025-08-05 |
| 12260582 | Image processing system and method | Kentaro WADA, Edgar Antonio Sucar Escamilla, Daniel James Lenton, Andrew Davison | 2025-03-25 |
| 12053886 | Device control using policy training based on task embeddings | Michael Bloesch, Andrew Davison | 2024-08-06 |
| 10443733 | Seal assembly with energizer and seal element | Mark C. Sitko, Simone Kaare Thorndal, Gert Iversen | 2019-10-15 |
| 9359843 | Anchoring system and method of anchoring and unanchoring the same | Nicholas K. Tonti | 2016-06-07 |
| 8716847 | Inserts for directing molding compound flow and semiconductor die assemblies | — | 2014-05-06 |
| 8399966 | Inserts for directing molding compound flow and semiconductor die assemblies | — | 2013-03-19 |
| 8207599 | Method and apparatus for directing molding compound flow and resulting semiconductor device packages | — | 2012-06-26 |
| 7927923 | Method and apparatus for directing molding compound flow and resulting semiconductor device packages | — | 2011-04-19 |
| 7501309 | Standoffs for centralizing internals in packaging process | Vernon Williams | 2009-03-10 |
| 7462510 | Standoffs for centralizing internals in packaging process | Vernon Williams | 2008-12-09 |
| 7459797 | Standoffs for centralizing internals in packaging process | Vernon Williams | 2008-12-02 |
| 7323767 | Standoffs for centralizing internals in packaging process | Vernon Williams | 2008-01-29 |
| 7271036 | Leadframe alteration to direct compound flow into package | — | 2007-09-18 |
| 7271037 | Leadframe alteration to direct compound flow into package | — | 2007-09-18 |
| 7247927 | Leadframe alteration to direct compound flow into package | — | 2007-07-24 |
| 7053467 | Leadframe alteration to direct compound flow into package | — | 2006-05-30 |
| 7054161 | Slotted adhesive for die-attach in BOC and LOC packages | — | 2006-05-30 |
| 7049685 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices | Chad A. Cobbley | 2006-05-23 |
| 6979595 | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices | Chad A. Cobbley | 2005-12-27 |
| 6815835 | Single sided adhesive tape for compound diversion on BOC substrates | — | 2004-11-09 |
| 6734372 | Gate area relief strip for a molded I/C package | Richard W. Wensel, Brad D. Rumsey | 2004-05-11 |
| 6690086 | Apparatus and method for reducing interposer compression during molding process | Brad D. Rumsey | 2004-02-10 |
| 6657132 | Single sided adhesive tape for compound diversion on BOC substrates | — | 2003-12-02 |
| 6518678 | Apparatus and method for reducing interposer compression during molding process | Brad D. Rumsey | 2003-02-11 |