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SJ

Stephen James — 32 Patents

Micron: 23 patents #784 of 6,374Top 15%

IIImperial College Innovations: 3 patents #10 of 353Top 3%

BHBaker Hughes Holdings: 1 patents #3,868 of 4,186Top 95%

BABiovitrum Ab: 1 patents #52 of 104Top 50%

CHCoopers Animal Health: 1 patents #6 of 12Top 50%

Overall (All Time): #110,428 of 4,157,543Top 3%

32 Patents All Time

Stephen James has been granted 32 US patents while listed as an inventor at Micron. The first was granted in 1995 and the most recent in August 2025. Stephen James ranks #110,428 of 4,157,543 US inventors in our database (top 2.7%). Patent records list Stephen James in London, TX, GB.

Patents per Year

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12380592	Image processing system and method	Kentaro WADA, Edgar Antonio Sucar Escamilla, Daniel James Lenton, Andrew Davison	2025-08-05
12260582	Image processing system and method	Kentaro WADA, Edgar Antonio Sucar Escamilla, Daniel James Lenton, Andrew Davison	2025-03-25
12053886	Device control using policy training based on task embeddings	Michael Bloesch, Andrew Davison	2024-08-06
10443733	Seal assembly with energizer and seal element	Mark C. Sitko, Simone Kaare Thorndal, Gert Iversen	2019-10-15
9359843	Anchoring system and method of anchoring and unanchoring the same	Nicholas K. Tonti	2016-06-07	$9,826,000
8716847	Inserts for directing molding compound flow and semiconductor die assemblies	—	2014-05-06	$7,858,000
8399966	Inserts for directing molding compound flow and semiconductor die assemblies	—	2013-03-19	$2,327,000
8207599	Method and apparatus for directing molding compound flow and resulting semiconductor device packages	—	2012-06-26	$3,081,000
7927923	Method and apparatus for directing molding compound flow and resulting semiconductor device packages	—	2011-04-19	$3,891,000
7501309	Standoffs for centralizing internals in packaging process	Vernon Williams	2009-03-10	$2,830,000
7462510	Standoffs for centralizing internals in packaging process	Vernon Williams	2008-12-09	$1,742,000
7459797	Standoffs for centralizing internals in packaging process	Vernon Williams	2008-12-02	$734,000
7323767	Standoffs for centralizing internals in packaging process	Vernon Williams	2008-01-29	$1,719,000
7271036	Leadframe alteration to direct compound flow into package	—	2007-09-18	$885,000
7271037	Leadframe alteration to direct compound flow into package	—	2007-09-18	$885,000
7247927	Leadframe alteration to direct compound flow into package	—	2007-07-24	$2,591,000
7053467	Leadframe alteration to direct compound flow into package	—	2006-05-30	$2,322,000
7054161	Slotted adhesive for die-attach in BOC and LOC packages	—	2006-05-30
7049685	Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices	Chad A. Cobbley	2006-05-23	$2,569,000
6979595	Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices	Chad A. Cobbley	2005-12-27	$1,583,000
6815835	Single sided adhesive tape for compound diversion on BOC substrates	—	2004-11-09	$1,311,000
6734372	Gate area relief strip for a molded I/C package	Richard W. Wensel, Brad D. Rumsey	2004-05-11	$2,113,000
6690086	Apparatus and method for reducing interposer compression during molding process	Brad D. Rumsey	2004-02-10	$2,630,000
6657132	Single sided adhesive tape for compound diversion on BOC substrates	—	2003-12-02	$2,846,000
6518678	Apparatus and method for reducing interposer compression during molding process	Brad D. Rumsey	2003-02-11	$1,748,000