Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7557452 | Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same | Ford B. Grigg, Bret K. Street | 2009-07-07 |
| 7501309 | Standoffs for centralizing internals in packaging process | Stephen James | 2009-03-10 |
| 7462510 | Standoffs for centralizing internals in packaging process | Stephen James | 2008-12-09 |
| 7459797 | Standoffs for centralizing internals in packaging process | Stephen James | 2008-12-02 |
| 7323767 | Standoffs for centralizing internals in packaging process | Stephen James | 2008-01-29 |
| 7273802 | Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads | — | 2007-09-25 |
| 7264456 | Leadframe and method for reducing mold compound adhesion problems | Michael Gifford | 2007-09-04 |
| 7239015 | Heat sinks including nonlinear passageways | Bret K. Street | 2007-07-03 |
| 7205654 | Programmed material consolidation methods for fabricating heat sinks | Bret K. Street | 2007-04-17 |
| 7137193 | Programmed material consolidation methods for fabricating printed circuit board | — | 2006-11-21 |
| 7029256 | Leadframe and method for removing cleaning compound flash from mold vents | Michael Gifford | 2006-04-18 |
| 7026191 | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same | Bret K. Street | 2006-04-11 |
| 6977211 | Selective consolidation processes for electrically connecting contacts of semiconductor device components | — | 2005-12-20 |
| 6863516 | Transfer molding and underfilling apparatus | — | 2005-03-08 |
| 6838319 | Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially vertically | — | 2005-01-04 |
| 6830954 | Transfer molding and underfilling method and apparatus | — | 2004-12-14 |
| 6815253 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods | — | 2004-11-09 |
| 6780744 | Stereolithographic methods for securing conductive elements to contacts of semiconductor device components | — | 2004-08-24 |
| 6767815 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods | — | 2004-07-27 |
| 6764935 | Stereolithographic methods for fabricating conductive elements | — | 2004-07-20 |
| 6764933 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods | — | 2004-07-20 |
| 6730998 | Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same | Bret K. Street | 2004-05-04 |
| 6666997 | Method for removing cleaning compound flash from mold vents | Michael Gifford | 2003-12-23 |
| 6632732 | Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methods | — | 2003-10-14 |
| 6602430 | Methods for finishing microelectronic device packages | Steven P. Nally, Ford B. Grigg | 2003-08-05 |