Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7384805 | Transfer mold semiconductor packaging processes | Larry D. Kinsman, Jeff Reeder | 2008-06-10 |
| 7148083 | Transfer mold semiconductor packaging processes | Larry D. Kinsman, Jeff Reeder | 2006-12-12 |
| 7095115 | Circuit substrates, semiconductor packages, and ball grid arrays | Larry D. Kinsman, Jeff Reeder | 2006-08-22 |
| 7061082 | Semiconductor die with attached heat sink and transfer mold | — | 2006-06-13 |
| 6921860 | Microelectronic component assemblies having exposed contacts | Darin L. Peterson, Choon Kuan Lee, James A. Faull | 2005-07-26 |
| 6869811 | Methods for transfer molding encapsulation of a semiconductor die with attached heat sink | — | 2005-03-22 |
| 6734372 | Gate area relief strip for a molded I/C package | Stephen James, Brad D. Rumsey | 2004-05-11 |
| 6707165 | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device | — | 2004-03-16 |
| 6677681 | Carrier substrate and carrier assembly using residual organic compounds to facilitate gate break | — | 2004-01-13 |
| 6664646 | Chip-on-board assemblies, carrier assemblies and carrier substrates using residual organic compounds to facilitate gate break | — | 2003-12-16 |
| 6583504 | Semiconductor die with attached heat sink and transfer mold | — | 2003-06-24 |
| 6576057 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding | — | 2003-06-10 |
| 6555412 | Packaged semiconductor chip and method of making same | — | 2003-04-29 |
| 6555898 | Dam structure for center-bonded chip package | — | 2003-04-29 |
| 6545368 | Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 2003-04-08 |
| 6524960 | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device | — | 2003-02-25 |
| 6518186 | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device | — | 2003-02-11 |
| 6486004 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding | — | 2002-11-26 |
| 6473311 | Gate area relief strip for a molded I/C package | Stephen James, Brad D. Rumsey | 2002-10-29 |
| 6444497 | Method and apparatus for reducing BGA warpage caused by encapsulation | Scott L. Gooch | 2002-09-03 |
| 6417028 | Method and apparatus for removing contaminants on electronic devices | — | 2002-07-09 |
| 6404069 | Use of oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 2002-06-11 |
| 6403387 | Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink | — | 2002-06-11 |
| 6387731 | Method and apparatus for reducing BGA warpage caused by encapsulation | Scott L. Gooch | 2002-05-14 |
| 6373132 | Semiconductor die with attached heat sink and transfer mold | — | 2002-04-16 |