Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7384805 | Transfer mold semiconductor packaging processes | Larry D. Kinsman, Richard W. Wensel | 2008-06-10 | $2,146,000 |
| 7148083 | Transfer mold semiconductor packaging processes | Larry D. Kinsman, Richard W. Wensel | 2006-12-12 | $1,954,000 |
| 7095115 | Circuit substrates, semiconductor packages, and ball grid arrays | Larry D. Kinsman, Richard W. Wensel | 2006-08-22 | $2,069,000 |