Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6316290 | Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate | — | 2001-11-13 |
| 6291899 | Method and apparatus for reducing BGA warpage caused by encapsulation | Scott L. Gooch | 2001-09-18 |
| 6251702 | Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 2001-06-26 |
| 6249050 | Encapsulated transfer molding of a semiconductor die with attached heat sink | — | 2001-06-19 |
| 6230719 | Apparatus for removing contaminants on electronic devices | — | 2001-05-15 |
| 6192956 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding | — | 2001-02-27 |
| 6117708 | Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device | — | 2000-09-12 |
| 6096163 | Method and apparatus for application of spray adhesive to a leadframe for chip bonding | — | 2000-08-01 |
| 6030857 | Method for application of spray adhesive to a leadframe for chip bonding | — | 2000-02-29 |
| 6001672 | Method for transfer molding encapsulation of a semiconductor die with attached heat sink | — | 1999-12-14 |
| 5989941 | Encapsulated integrated circuit packaging | — | 1999-11-23 |
| 5969427 | Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 1999-10-19 |
| 5963792 | Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device | — | 1999-10-05 |
| 5959349 | Transfer molding encapsulation of a semiconductor die with attached heat sink | — | 1999-09-28 |
| 5936310 | De-wetting material for glob top applications | — | 1999-08-10 |
| 5885854 | Method for application of de-wetting material for glob top applications | — | 1999-03-23 |