Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12376219 | Circuit board structures for component protection | João Elmiro da Rocha Chaves, Kristopher D. Hamrick | 2025-07-29 |
| 12207411 | Printed wiring boards, printed wiring board assemblies, and electronic systems | Kristopher D. Hamrick, James J. Oleary, Mark A. Tverdy | 2025-01-21 |
| 11997782 | Thermally conductive label for circuit | Kaleb A. Wilson, Shams U. Arifeen, João Elmiro da Rocha Chaves, Mark A. Tverdy | 2024-05-28 |
| 11749666 | Semiconductor die assemblies having molded underfill structures and related technology | Xiao Li | 2023-09-05 |
| 11688664 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2023-06-27 |
| 11676955 | Separation method and assembly for chip-on-wafer processing | Andrew M. Bayless | 2023-06-13 |
| 11004828 | Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices | Brandon P. Wirz, Pei Sian Shao | 2021-05-11 |
| 10916487 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2021-02-09 |
| 10804256 | Semiconductor die assemblies having molded underfill structures and related technology | Xiao Li | 2020-10-13 |
| 10424531 | Method for manufacturing a semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2019-09-24 |
| 10074633 | Semiconductor die assemblies having molded underfill structures and related technology | Xiao Li | 2018-09-11 |
| 9960150 | Semiconductor device assembly with through-mold cooling channel formed in encapsulant | Xiao Li, Jaspreet S. Gandhi | 2018-05-01 |
| 8709878 | Methods of packaging imager devices and optics modules, and resulting assemblies | Todd O. Bolken, Scott Willmorth | 2014-04-29 |
| 8110884 | Methods of packaging imager devices and optics modules, and resulting assemblies | Todd O. Bolken, Scott Willmorth | 2012-02-07 |