Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394771 | Semiconductor die assemblies with sidewall protection and associated methods and systems | Yu-Lin Kao, Chun-Min LIN, Sui Chi Huang | 2025-08-19 |
| 11004828 | Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices | Brandon P. Wirz, Bradley R. Bitz | 2021-05-11 |