Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406847 | Microelectronic devices and related methods of fabricating microelectronic devices | Brandon P. Wirz | 2025-09-02 |
| 12100661 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Brandon P. Wirz | 2024-09-24 |
| 12087697 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Brandon P. Wirz | 2024-09-10 |
| 11961818 | Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems | Brandon P. Wirz | 2024-04-16 |
| 11791212 | Thin die release for semiconductor device assembly | Brandon P. Wirz | 2023-10-17 |
| 11784092 | Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing | Brandon P. Wirz | 2023-10-10 |
| 11784050 | Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus | Brandon P. Wirz | 2023-10-10 |
| 11776908 | Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods | Brandon P. Wirz | 2023-10-03 |
| 11764096 | Method for semiconductor die edge protection and semiconductor die separation | Brandon P. Wirz | 2023-09-19 |
| 11715696 | Semiconductor devices with recessed pads for die stack interconnections | Ruei Ying Sheng, Brandon P. Wirz | 2023-08-01 |
| 11676955 | Separation method and assembly for chip-on-wafer processing | Bradley R. Bitz | 2023-06-13 |
| 11646269 | Recessed semiconductor devices, and associated systems and methods | Brandon P. Wirz | 2023-05-09 |
| 11515171 | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices | Xiaopeng Qu, Hyunsuk Chun, Brandon P. Wirz | 2022-11-29 |
| 11410961 | Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies | Brandon P. Wirz | 2022-08-09 |
| 11289360 | Methods and apparatus for protection of dielectric films during microelectronic component processing | Brandon P. Wirz, Wei Zhou | 2022-03-29 |
| 11239129 | Package cooling by coil cavity | Wayne H. Huang, Owen R. Fay | 2022-02-01 |
| 11195740 | Methods and apparatus for wafer handling and processing | Kyle K. Kirby | 2021-12-07 |
| 11189590 | Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies | Brandon P. Wirz | 2021-11-30 |
| 11189609 | Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices | Brandon P. Wirz | 2021-11-30 |
| 10971471 | Methods and systems for manufacturing semiconductor devices | Cassie L. Bayless | 2021-04-06 |
| 10861765 | Carrier removal by use of multilayer foil | James M. Derderian, Xiao Li | 2020-12-08 |
| 10770421 | Bond chucks having individually-controllable regions, and associated systems and methods | Cassie L. Bayless | 2020-09-08 |
| 10770422 | Bond chucks having individually-controllable regions, and associated systems and methods | Cassie L. Bayless | 2020-09-08 |
| 10763186 | Package cooling by coil cavity | Wayne H. Huang, Owen R. Fay | 2020-09-01 |
| 10749071 | Apparatus for processing device structures | — | 2020-08-18 |