| 11735549 |
Methods and systems for manufacturing pillar structures on semiconductor devices |
Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj |
2023-08-22 |
$9,108,000 |
| 11631630 |
Pillar-last methods for forming semiconductor devices |
Anilkumar Chandolu, Sameer S. Vadhavkar |
2023-04-18 |
$17,530,000 |
| 11239129 |
Package cooling by coil cavity |
Andrew M. Bayless, Owen R. Fay |
2022-02-01 |
$13,825,000 |
| 11139159 |
Methods of removing particles from over semiconductor substrates |
Joseph Neil Greeley, Dan B. Millward |
2021-10-05 |
$16,233,000 |
| 11081460 |
Methods and systems for manufacturing pillar structures on semiconductor devices |
Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar, Adriel Jebin Jacob Jebaraj |
2021-08-03 |
$20,873,000 |
| 10957625 |
Pillar-last methods for forming semiconductor devices |
Anilkumar Chandolu, Sameer S. Vadhavkar |
2021-03-23 |
$19,320,000 |
| 10886244 |
Collars for under-bump metal structures and associated systems and methods |
Giorgio Mariottini, Sameer S. Vadhavkar, Anilkumar Chandolu, Mark Bossier |
2021-01-05 |
$21,674,000 |
| 10763186 |
Package cooling by coil cavity |
Andrew M. Bayless, Owen R. Fay |
2020-09-01 |
$15,473,000 |
| 10692733 |
Uniform back side exposure of through-silicon vias |
Jaspreet S. Gandhi |
2020-06-23 |
$14,650,000 |
| 10410879 |
Uniform back side exposure of through-silicon vias |
Jaspreet S. Gandhi |
2019-09-10 |
$13,427,000 |
| 10262922 |
Semiconductor device having through-silicon-via and methods of forming the same |
Jaspreet S. Gandhi |
2019-04-16 |
$25,657,000 |
| 10137481 |
Methods of removing particles from over semiconductor substrates |
Joseph Neil Greeley, Dan B. Millward |
2018-11-27 |
$19,088,000 |
| 9941190 |
Semiconductor device having through-silicon-via and methods of forming the same |
Jaspreet S. Gandhi |
2018-04-10 |
$31,959,000 |
| 9837383 |
Interconnect structure with improved conductive properties and associated systems and methods |
Jaspreet S. Gandhi, James M. Derderian |
2017-12-05 |
$37,086,000 |
| 9818622 |
Uniform back side exposure of through-silicon vias |
Jaspreet S. Gandhi |
2017-11-14 |
$54,846,000 |
| 9780052 |
Collars for under-bump metal structures and associated systems and methods |
Giorgio Mariottini, Sameer S. Vadhavkar, Anilkumar Chandolu, Mark Bossler |
2017-10-03 |
$8,798,000 |
| 9412675 |
Interconnect structure with improved conductive properties and associated systems and methods |
Jaspreet S. Gandhi, James M. Derderian |
2016-08-09 |
$9,565,000 |
| 9397078 |
Semiconductor device assembly with underfill containment cavity |
Anilkumar Chandolu, Sameer S. Vadhavkar |
2016-07-19 |
$16,029,000 |
| 9153451 |
Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structure |
Andrew Carswell, Siddartha Kondoju, Jin Lu, Suresh Ramakrishnan, Kozaburo Sakai +2 more |
2015-10-06 |
$10,070,000 |
| 8974655 |
Methods of planarization and electro-chemical mechanical polishing processes |
Whonchee Lee |
2015-03-10 |
$15,588,000 |
| 8956974 |
Devices, systems, and methods related to planarizing semiconductor devices after forming openings |
Anurag Jindal |
2015-02-17 |
$18,841,000 |
| 8940102 |
Methods of removing particles from over semiconductor substrates |
Neil Greeley, Dan B. Millward |
2015-01-27 |
$26,039,000 |
| 8809157 |
Methods of forming a programmable region that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion |
D. V. Nirmal Ramaswamy, Beth R. Cook, Lei Bi, Ian C. Laboriante |
2014-08-19 |
$23,693,000 |
| 8633084 |
Methods of forming a memory cell having programmable material that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion |
D. V. Nirmal Ramaswamy, Beth R. Cook, Lei Bi, Ian C. Laboriante |
2014-01-21 |
$9,005,000 |
| 8226772 |
Methods of removing particles from over semiconductor substrates |
Neil Greeley, Dan B. Millward |
2012-07-24 |
$3,889,000 |
