Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of removing particles from over semiconductor substrates

Methods of removing particles from over semiconductor substrates

US Patent 11139159 · Granted Oct 5, 2021

Estimated economic value: $16,233,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pitch reduction technology using alternating spacer depositions during the forma2025
Adhesion promoting photoresist underlayer composition2025
Pitch reduction technology using alternating spacer depositions during the forma2024
Methods and systems for manufacturing pillar structures on semiconductor devices2023
Pillar-last methods for forming semiconductor devices2023
Stamps including a self-assembled block copolymer material, and related methods2023
Pitch reduction technology using alternating spacer depositions during the forma2022
Methods of forming a semiconductor device using block copolymer materials2022
Package cooling by coil cavity2022
Methods and systems for manufacturing pillar structures on semiconductor devices2021
Pillar-last methods for forming semiconductor devices2021
Collars for under-bump metal structures and associated systems and methods2021