Adhesion promoting photoresist underlayer composition

Assignee

• Dupont Electronic Materials International

Inventors

• Joshua Kaitz (8 patents)
• Ke Yang (36 patents)
• Keren Zhang (16 patents)
• Li Cui (24 patents)
• James F. Cameron (88 patents)
• Dan B. Millward (103 patents)
• Shintaro Yamada (40 patents)

View full patent text on Google Patents →