Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12269106 | Two-step solder-mask-defined design | Koustav Sinha | 2025-04-08 |
| 12243801 | Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Xiaopeng Qu, Chan H. Yoo | 2025-03-04 |
| 12028962 | Thermal management of circuit boards | Xiaopeng Qu | 2024-07-02 |
| 12015011 | Semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Xiaopeng Qu | 2024-06-18 |
| 11915997 | Thermal management of GPU-HBM package by microchannel integrated substrate | Xiaopeng Qu, Eiichi Nakano | 2024-02-27 |
| 11887920 | Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods | Chan H. Yoo, Tracy N. Tennant | 2024-01-30 |
| 11848282 | Semiconductor devices having crack-inhibiting structures | Sheng-Wei Yang, Shams U. Arifeen | 2023-12-19 |
| 11688658 | Semiconductor device | Shams U. Arifeen, Chan H. Yoo, Tracy N. Tennant | 2023-06-27 |
| 11676932 | Semiconductor interconnect structures with narrowed portions, and associated systems and methods | Thiagarajan Raman | 2023-06-13 |
| 11616028 | Semiconductor devices having crack-inhibiting structures | Shams U. Arifeen, Sheng-Wei Yang, Keizo Kawakita | 2023-03-28 |
| 11557526 | Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Xiaopeng Qu, Chan H. Yoo | 2023-01-17 |
| 11538762 | Methods for making double-sided semiconductor devices and related devices, assemblies, packages and systems | — | 2022-12-27 |
| 11515171 | Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices | Xiaopeng Qu, Brandon P. Wirz, Andrew M. Bayless | 2022-11-29 |
| 11444037 | Semiconductor devices having crack-inhibiting structures | Sheng-Wei Yang, Shams U. Arifeen | 2022-09-13 |
| 11419239 | Thermal management of circuit boards | Xiaopeng Qu | 2022-08-16 |
| 11385281 | Heat spreaders for use in semiconductor device testing, such as burn-in testing | Xiaopeng Qu, Amy R. Griffin | 2022-07-12 |
| 11207744 | Two-step solder-mask-defined design | Koustav Sinha | 2021-12-28 |
| 11211364 | Semiconductor device assemblies and systems with improved thermal performance and methods for making the same | Xiaopeng Qu | 2021-12-28 |
| 11011452 | Heat spreaders for semiconductor devices, and associated systems and methods | Xiaopeng Qu, Amy R. Griffin | 2021-05-18 |
| 10861782 | Redistribution layers including reinforcement structures and related semiconductor device packages, systems and methods | Chan H. Yoo, Tracy N. Tennant | 2020-12-08 |
| 10811365 | Semiconductor devices having crack-inhibiting structures | Shams U. Arifeen, Sheng-Wei Yang, Keizo Kawakita | 2020-10-20 |
| 10784212 | Semiconductor devices having crack-inhibiting structures | Sheng-Wei Yang, Shams U. Arifeen | 2020-09-22 |
| 10653033 | Kits for enhanced cooling of components of computing devices and related computing devices, systems and methods | Xiaopeng Qu | 2020-05-12 |
| 10515911 | Semiconductor devices | Jong Woo Park, Chul Park, Jeong-Won Yoon | 2019-12-24 |
| 9601466 | Semiconductor package and method of manufacturing the same | Jeongwon Yoon, Boin Noh, Baikwoo Lee | 2017-03-21 |