Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
KS

Koustav Sinha — 15 Patents

Micron: 14 patents #1,220 of 6,374Top 20%
Boise, ID: #609 of 3,546 inventorsTop 20%
Idaho: #919 of 8,810 inventorsTop 15%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Koustav Sinha has been granted 15 US patents while listed as an inventor at Micron. The first was granted in 2021 and the most recent in June 2025. Koustav Sinha ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Koustav Sinha in Boise, ID, US.

Patents per Year

Patents granted per year, 2021 to 2025Bar chart with a peak of 5 patents in 2023.peak 52021: 1 patents20212022: 2 patents20222023: 5 patents20232024: 2 patents20242025: 5 patents2025

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12341110 Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices Quang Nguyen, Christopher Glancey, Shams U. Arifeen 2025-06-24
12269106 Two-step solder-mask-defined design Hyunsuk Chun 2025-04-08
12218079 Semiconductor devices with reinforced substrates Shams U. Arifeen, Christopher Glancey 2025-02-04
12211814 Semiconductor interconnect structures with conductive elements, and associated systems and methods Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Chan H. Yoo 2025-01-28
12211822 Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods Shams U. Arifeen, Christopher Glancey 2025-01-28
11908803 Semiconductor devices with flexible connector array Xiaopeng Qu 2024-02-20 $18,735,000
11869862 Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems Shams U. Arifeen, Christopher Glancey 2024-01-09 $10,439,000
11769752 Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods Shams U. Arifeen, Christopher Glancey 2023-09-26 $14,458,000
11728307 Semiconductor interconnect structures with conductive elements, and associated systems and methods Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Chan H. Yoo 2023-08-15 $9,169,000
11664360 Circuit board with spaces for embedding components Quang Nguyen, Christopher Glancey, Shams U. Arifeen 2023-05-30 $12,815,000
11646286 Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints Shams U. Arifeen, Christopher Glancey, Xiao Li 2023-05-09 $19,484,000
11552029 Semiconductor devices with reinforced substrates Shams U. Arifeen, Christopher Glancey 2023-01-10 $13,847,000
11348875 Semiconductor devices with flexible connector array Xiaopeng Qu 2022-05-31 $17,698,000
11276659 Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements Shams U. Arifeen, Christopher Glancey 2022-03-15 $16,938,000
11207744 Two-step solder-mask-defined design Hyunsuk Chun 2021-12-28 $20,140,000