Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341110 | Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices | Quang Nguyen, Christopher Glancey, Shams U. Arifeen | 2025-06-24 |
| 12269106 | Two-step solder-mask-defined design | Hyunsuk Chun | 2025-04-08 |
| 12218079 | Semiconductor devices with reinforced substrates | Shams U. Arifeen, Christopher Glancey | 2025-02-04 |
| 12211814 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Chan H. Yoo | 2025-01-28 |
| 12211822 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Shams U. Arifeen, Christopher Glancey | 2025-01-28 |
| 11908803 | Semiconductor devices with flexible connector array | Xiaopeng Qu | 2024-02-20 |
| 11869862 | Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems | Shams U. Arifeen, Christopher Glancey | 2024-01-09 |
| 11769752 | Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods | Shams U. Arifeen, Christopher Glancey | 2023-09-26 |
| 11728307 | Semiconductor interconnect structures with conductive elements, and associated systems and methods | Shams U. Arifeen, Quang Nguyen, Christopher Glancey, Chan H. Yoo | 2023-08-15 |
| 11664360 | Circuit board with spaces for embedding components | Quang Nguyen, Christopher Glancey, Shams U. Arifeen | 2023-05-30 |
| 11646286 | Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints | Shams U. Arifeen, Christopher Glancey, Xiao Li | 2023-05-09 |
| 11552029 | Semiconductor devices with reinforced substrates | Shams U. Arifeen, Christopher Glancey | 2023-01-10 |
| 11348875 | Semiconductor devices with flexible connector array | Xiaopeng Qu | 2022-05-31 |
| 11276659 | Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements | Shams U. Arifeen, Christopher Glancey | 2022-03-15 |
| 11207744 | Two-step solder-mask-defined design | Hyunsuk Chun | 2021-12-28 |