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Home › Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements

Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements

US Patent 11276659 · Granted Mar 15, 2022

Estimated economic value: $16,938,000 ⓘ

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