| 12341110 |
Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devices |
Koustav Sinha, Quang Nguyen, Shams U. Arifeen |
2025-06-24 |
| 12218079 |
Semiconductor devices with reinforced substrates |
Koustav Sinha, Shams U. Arifeen |
2025-02-04 |
| 12211814 |
Semiconductor interconnect structures with conductive elements, and associated systems and methods |
Shams U. Arifeen, Quang Nguyen, Koustav Sinha, Chan H. Yoo |
2025-01-28 |
| 12211822 |
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods |
Shams U. Arifeen, Koustav Sinha |
2025-01-28 |
| 11869862 |
Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems |
Shams U. Arifeen, Koustav Sinha |
2024-01-09 |
| 11855002 |
Warpage control in microelectronic packages, and related assemblies and methods |
Shams U. Arifeen |
2023-12-26 |
| 11769752 |
Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods |
Shams U. Arifeen, Koustav Sinha |
2023-09-26 |
| 11728307 |
Semiconductor interconnect structures with conductive elements, and associated systems and methods |
Shams U. Arifeen, Quang Nguyen, Koustav Sinha, Chan H. Yoo |
2023-08-15 |
| 11664360 |
Circuit board with spaces for embedding components |
Quang Nguyen, Shams U. Arifeen, Koustav Sinha |
2023-05-30 |
| 11646286 |
Processes for forming self-healing solder joints and repair of same, related solder joints, and microelectronic components, assemblies and electronic systems incorporating such solder joints |
Shams U. Arifeen, Koustav Sinha, Xiao Li |
2023-05-09 |
| 11552029 |
Semiconductor devices with reinforced substrates |
Koustav Sinha, Shams U. Arifeen |
2023-01-10 |
| 11276659 |
Methods for forming elements for microelectronic components, related conductive elements, and microelectronic components, assemblies and electronic systems incorporating such conductive elements |
Shams U. Arifeen, Koustav Sinha |
2022-03-15 |
| 11031353 |
Warpage control in microelectronic packages, and related assemblies and methods |
Shams U. Arifeen |
2021-06-08 |
