Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300647 | Apparatus including integrated pads and methods of manufacturing the same | Wei Zhou | 2025-05-13 |
| 11824025 | Apparatus including integrated pads and methods of manufacturing the same | Wei Zhou | 2023-11-21 |
| 11676932 | Semiconductor interconnect structures with narrowed portions, and associated systems and methods | Hyunsuk Chun | 2023-06-13 |
| 10566300 | Bond pads with surrounding fill lines | Scott K. Pozder, Kristina Young-Fisher, David B. Stone | 2020-02-18 |