Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8277286 | Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method | Zin-Chang Wei, Huang Soon Kang, Chyi Shyuan Chern | 2012-10-02 |
| 6638868 | Method for preventing or reducing anodic Cu corrosion during CMP | Tsu Shih, Wen-Hun Tung, Wen-Chin Chiou | 2003-10-28 |