Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852932 | Method for processing semiconductor wafer | Mao-Lin Kao, Hsu-Shui Liu, Jiun-Rong Pai, Li-Jen Ko, Hsiang Yin Shen | 2017-12-26 |
| 9558974 | Semiconductor processing station and method for processing semiconductor wafer | Mao-Lin Kao, Hsu-Shui Liu, Li-Jen Ko, Hsiang Yin Shen, Jiun-Rong Pai | 2017-01-31 |
| 9281221 | Ultra-high vacuum (UHV) wafer processing | Chung-En Kao, Mao-Lin Kao, Kuo-Fu Chien, Keith Kuang-Kuo Koai | 2016-03-08 |
| 8057280 | Chemical mechanical planarization apparatus | Jung-Sheng Hou, Chun-Chin Huang | 2011-11-15 |
| 7824243 | Chemical mechanical planarization methods | Jung-Sheng Hou, Chun-Chin Huang | 2010-11-02 |
| 7823241 | System for cleaning a wafer | Chih-Ming Hsieh, Chien-Chang Lai, Wen-Jin Lee, Da-Hsiang Chen | 2010-11-02 |
| 7014739 | Convex profile anode for electroplating system | Tro-Hsu Lin, Hong-Jin Pu, Zhi-Zan Zhuang | 2006-03-21 |
| 6914337 | Calibration wafer and kit | Chih-Nan Chuang, Tro-Hsu Lin, Cheng-Fang Chang | 2005-07-05 |
| 6837774 | Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using | Jih-Churng Twu | 2005-01-04 |
| 6726532 | Belt tensioning assembly for CMP apparatus | Hun-Yi Lin, Tso-Hsu Lin, Hong-Chin Pu, Jeng-Fang Chang, Der-Yuan Hong | 2004-04-27 |
| 6722949 | Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using | Jih-Churng Twu | 2004-04-20 |
| 6649077 | Method and apparatus for removing coating layers from alignment marks on a wafer | Pang-Yen Tsai, Sen Yang, Wei-Cheng Ku | 2003-11-18 |
| 6561880 | Apparatus and method for cleaning the polishing pad of a linear polisher | Feng-Chih Hsu | 2003-05-13 |
| 6524959 | Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control | Chen-Fa Lu, Chen-Peng Fan, Jui-Ping Chuang | 2003-02-25 |
| 6517413 | Method for a copper CMP endpoint detection system | Jin-Churng Twu, Chen-Fa Lu | 2003-02-11 |
| 6315649 | Wafer mounting plate for a polishing apparatus and method of using | Tsen-Hsing Yi, Chien-Hsien Lee, Ming-Yi Lee | 2001-11-13 |
| 6227947 | Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer | Jih-Churng Twu, Ying-Ho Chen, Tsu Shih | 2001-05-08 |
| 5929324 | Apparatus for detecting leakage in a gas reactor | Philip J. Lin | 1999-07-27 |