Issued Patents All Time
Showing 26–39 of 39 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6405452 | Method and apparatus for drying wafers after wet bench | Ming-Dar Guo, Yu-Chien Hsiao, Chia-Chun Cheng | 2002-06-18 |
| 6391780 | Method to prevent copper CMP dishing | Tsu Shih, Ying-Ho Chen | 2002-05-21 |
| 6380056 | Lightly nitridation surface for preparing thin-gate oxides | Shau-Lin Shue | 2002-04-30 |
| 6376377 | Post chemical mechanical polish (CMP) planarizing substrate cleaning method employing enhanced substrate hydrophilicity | Weng Chang, Ying-Ho Chen, Syun-Ming Jang | 2002-04-23 |
| 6358119 | Way to remove CU line damage after CU CMP | Tsu Shih, Ying-Ho Chen, Syun-Ming Jang | 2002-03-19 |
| 6239023 | Method to reduce the damages of copper lines | Syun-Ming Jang, Ying-Ho Chen, Chen-Hua Yu | 2001-05-29 |
| 6228760 | Use of PE-SiON or PE-OXIDE for contact or via photo and for defect reduction with oxide and W chemical-mechanical polish | Chen-Hua Yu, Syun-Ming Jang, Tsu Shih, Anthony Yen | 2001-05-08 |
| 6227947 | Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer | Tien-Chen Hu, Ying-Ho Chen, Tsu Shih | 2001-05-08 |
| 6211098 | Wet oxidation method for forming silicon oxide dielectric layer | Syun-Ming Jang, Chen-Hua Yu | 2001-04-03 |
| 6197701 | Lightly nitridation surface for preparing thin-gate oxides | Shau-Lin Shue | 2001-03-06 |
| 6197669 | Reduction of surface defects on amorphous silicon grown by a low-temperature, high pressure LPCVD process | Syun-Ming Jang, Chen-Hua Yu | 2001-03-06 |
| 6162716 | Amorphous silicon gate with mismatched grain-boundary microstructure | Chen-Hua Yu | 2000-12-19 |
| 6153526 | Method to remove residue in wolfram CMP | Tsu Shih | 2000-11-28 |
| 6080656 | Method for forming a self-aligned copper structure with improved planarity | Tsu Shih, Ying-Ho Chen, Syun-Ming Jang | 2000-06-27 |