Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027446 | Method for forming a semiconductor component with a cooling structure | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2024-07-02 |
| 11515233 | Semiconductor component with cooling structure | Tung-Liang Shao, Chih-Hang Tung, Chen-Hua Yu, Yi-Li Hsiao | 2022-11-29 |
| 9905520 | Solder ball protection structure with thick polymer layer | Chen-Hua Yu, Hao-Yi Tsai, Chien-Hsiun Lee | 2018-02-27 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Kuo-Chung Yee, Chen-Hua Yu, Yeong-Jyh Lin, Chia-Hsiang Lin +1 more | 2017-02-28 |
| 8172641 | CMP by controlling polish temperature | Ming-Che Ho, Jean Wang | 2012-05-08 |
| 7172933 | Recessed polysilicon gate structure for a strained silicon MOSFET device | Yi-Chun Huang, Bow-Wen Chan, Baw-Ching Perng, Hun-Jan Tao, Chih-Hsin Ko +1 more | 2007-02-06 |