Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342309 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2022-05-24 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Tung-Liang Shao, Ching-Hua Hsieh, Chien Ling Hwang +2 more | 2022-05-24 |
| 11315900 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Tung-Liang Shao | 2022-04-26 |
| 11295979 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chen-Hua Yu | 2022-04-05 |
| 11121104 | Method for manufacturing interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2021-09-14 |
| 11107747 | Semiconductor package with composite thermal interface material structure and method of forming the same | Tung-Liang Shao, Jen-Yu Wang, Chung-Jung Wu, Chen-Hua Yu | 2021-08-31 |
| 11101195 | Package structure and method for forming the same | Tung-Liang Shao, Wen-Lin Shih, Su-Chun Yang, Chen-Hua Yu | 2021-08-24 |
| 11056459 | Chip package structure and method for forming the same | Tung-Liang Shao, Su-Chun Yang, Geng-Ming CHANG, Chen-Hua Yu | 2021-07-06 |
| 11018215 | Package and manufacturing method thereof | Wen-Shiang Liao | 2021-05-25 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chen-Hua Yu, Chewn-Pu Jou, Feng-Wei Kuo | 2021-02-16 |
| 10854580 | Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chen-Hua Yu | 2020-12-01 |
| 10734279 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chen-Hua Yu | 2020-08-04 |
| 10734348 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Tung-Liang Shao | 2020-08-04 |
| 10714457 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2020-07-14 |
| 10522491 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2019-12-31 |
| 10468385 | Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof | Wei-Heng Lin, Tung-Liang Shao, Chen-Hua Yu | 2019-11-05 |
| 10460987 | Semiconductor package device with integrated antenna and manufacturing method thereof | Wen-Shiang Liao, Feng-Wei Kuo, Chen-Hua Yu | 2019-10-29 |
| 10319690 | Semiconductor structure and manufacturing method thereof | Wen-Shiang Liao, Chewn-Pu Jou, Chen-Hua Yu | 2019-06-11 |
| 10290611 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Kuo-Chung Yee | 2019-05-14 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Tung-Liang Shao, Yi-Li Hsiao, Hsiao-Yun Chen, Chen-Hua Yu | 2019-03-12 |
| 10163835 | Solder bump stretching method | Su-Chun Yang, Yi-Li Hsiao, Chen-Hua Yu | 2018-12-25 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Wensen Hung, Hung-Chi Li, Cheng-Chieh Hsieh, Tung-Liang Shao | 2018-12-11 |
| 10141291 | Semiconductor device and method of manufacturing the same | Tung-Liang Shao, Chen-Hua Yu | 2018-11-27 |
| 10068868 | Multi-strike process for bonding packages and the packages thereof | Tung-Liang Shao, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2018-09-04 |
| 10034390 | Metal post bonding using pre-fabricated metal posts | Yi-Li Hsiao, Su-Chun Yang, Da-Yuan Shih, Chen-Hua Yu | 2018-07-24 |