Issued Patents All Time
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8803333 | Three-dimensional chip stack and method of forming the same | Chen-Hua Yu, Da-Yuan Shih | 2014-08-12 |
| 8754514 | Multi-chip wafer level package | Chun-Hui Yu, Tung-Liang Shao, Chen-Hua Yu, Da-Yuan Shih | 2014-06-17 |
| 8685798 | Methods for forming through vias | Tung-Liang Shao, Chen-Hua Yu, Hao-Yi Tsai, Mirng-Ji Lii, Da-Yuan Shih | 2014-04-01 |
| 8531032 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Tung-Liang Shao | 2013-09-10 |
| 8476770 | Apparatus and methods for forming through vias | Tung-Liang Shao, Chen-Hua Yu, Hao-Yi Tsai, Mirng-Ji Lii, Da-Yuan Shih | 2013-07-02 |
| 8308052 | Thermal gradient reflow for forming columnar grain structures for solder bumps | Chih-Horng Chang, Yian-Liang Kuo, Tsung-Fu Tsai | 2012-11-13 |