Issued Patents All Time
Showing 51–75 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9997467 | Semiconductor packages and methods of forming the same | Tung-Liang Shao, Chen-Hua Yu | 2018-06-12 |
| 9978709 | Solder bump stretching method for forming a solder bump joint in a device | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Da-Yuan Shih +1 more | 2018-05-22 |
| 9960134 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2018-05-01 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Yi-Li Hsiao, Tung-Liang Shao, Chen-Hua Yu | 2018-02-13 |
| 9881888 | Manufacturing method of interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2018-01-30 |
| 9842817 | Solder bump stretching method and device for performing the same | Su-Chun Yang, Yi-Li Hsiao, Chen-Hua Yu | 2017-12-12 |
| 9735276 | Non-planar transistors and methods of fabrication thereof | Chin-Hsiang Lin, Cheng-Hung Chang, Sey-Ping Sun | 2017-08-15 |
| 9679882 | Method of multi-chip wafer level packaging | Chun-Hui Yu, Chen-Hua Yu, Da-Yuan Shih | 2017-06-13 |
| 9576929 | Multi-strike process for bonding | Tung-Liang Shao, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2017-02-21 |
| 9564420 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Kuo-Chung Yee | 2017-02-07 |
| 9530715 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Tung-Liang Shao | 2016-12-27 |
| 9521795 | Two-step direct bonding processes and tools for performing the same | Yi-Li Hsiao, Da-Yuan Shih, Chen-Hua Yu | 2016-12-13 |
| 9475145 | Solder bump joint in a device including lamellar structures | Su-Chun Yang, Chung-Jung Wu, Hsiao-Yun Chen, Yi-Li Hsiao, Da-Yuan Shih +1 more | 2016-10-25 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Kai-Chiang Wu, Ming-Che Ho | 2016-10-18 |
| 9455183 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Cheng-Chang Wei | 2016-09-27 |
| 9343436 | Stacked package and method of manufacturing the same | Yi-Li Hsiao, Li-Yen Lin | 2016-05-17 |
| 9331038 | Semiconductor interconnect structure | Meng-Tse Chen, Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-05-03 |
| 9293437 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Kuo-Chung Yee | 2016-03-22 |
| 9263407 | Method for manufacturing a plurality of metal posts | Yi-Li Hsiao, Su-Chun Yang, Da-Yuan Shih, Chen-Hua Yu | 2016-02-16 |
| 9216469 | Indirect printing bumping method for solder ball deposition | Yi-Li Hsiao, Da-Yuan Shih, Chen-Hua Yu | 2015-12-22 |
| 9159686 | Crack stopper on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Han-Ping Pu, Kai-Chiang Wu, Ming-Che Ho | 2015-10-13 |
| 9136143 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Tung-Liang Shao | 2015-09-15 |
| 9082763 | Joint structure for substrates and methods of forming | Chen-Hua Yu, Da-Yuan Shih | 2015-07-14 |
| 9054194 | Non-planar transistors and methods of fabrication thereof | Chin-Hsiang Lin, Cheng-Hung Chang, Sey-Ping Sun | 2015-06-09 |
| 8927877 | Looped interconnect structure | Hsin-An Shen, Yung Ching Chen, Ming-Chung Sung, Chien-Hsun Lee, Da-Yuan Shih | 2015-01-06 |