Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348889 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung | 2022-05-31 |
| 11171235 | Semiconductor device and method for fabricating the same | Chia-Lin Hsu, Hsien-Ming Lee, Ji-Cheng Chen | 2021-11-09 |
| 10644153 | Semiconductor device and method for fabricating the same | Chia-Lin Hsu, Hsien-Ming Lee, Ji-Cheng Chen | 2020-05-05 |
| 10522491 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung | 2019-12-31 |
| 9960134 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung | 2018-05-01 |
| 9455183 | Semiconductor device and bump formation process | Yi-Li Hsiao, Chen-Hua Yu, Shin-Puu Jeng, Chih-Hang Tung | 2016-09-27 |