Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094836 | Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof | Wensen Hung, Hsien-Pin Hu, Tsung-Shu Lin, Tsung-Yu Chen, Wen-Hsin Wei | 2024-09-17 |
| 11855030 | Package structure and method of manufacturing the same | Tsung-Shu Lin | 2023-12-26 |
| 11069642 | Package structure and method of manufacturing the same | Tsung-Shu Lin | 2021-07-20 |