Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11286333 | Method for degradating thermosetting resin, catalyst composition used therein and resin composition obtained thereby | Kuei-Yi Chuang, Yen-Chun Liu | 2022-03-29 |
| 11247978 | Reversible crosslinking reactant composition | Kuei-Yi Chuang, Feng-Po Tseng | 2022-02-15 |
| 11015018 | Resin composition and method for manufacturing thermally conductive material | Yen-Chun Liu, Min Wang, Hsiang-Yen TSAO | 2021-05-25 |
| 11016385 | Photosensitive adhesive composition, photosensitive conductive adhesive composition, and electronic device containing photosensitive conductive adhesive composition | Yi Yang, Shou-Yi Ho | 2021-05-25 |
| 10954329 | Modified copolymer, method for preparing the same, and method for preparing paste | Shou-Yi Ho | 2021-03-23 |
| 10894853 | Furan-modified compound and oligomer | Kuei-Yi Chuang, Feng-Po Tseng | 2021-01-19 |
| 10858471 | Reversible crosslinking reactant composition | Kuei-Yi Chuang, Feng-Po Tseng | 2020-12-08 |
| 10752744 | Thermally conductive resin, resin composition, prepreg, and copper clad laminate | Feng-Po Tseng, Wen-Pin TING | 2020-08-25 |
| 10626219 | Polymers and resin composition employing the same | Kuei-Yi Chuang, Feng-Po Tseng | 2020-04-21 |
| 10329468 | Thermally conductive resin and thermal interface material comprising the same | Yen-Chun Liu, Hui-Wen Chang, Min Wang | 2019-06-25 |
| 10141083 | Transparent conductive film composite and transparent conductive film | Wei-Han Hsiao, Chun-Yi Chiu, Tzong-Ming Lee | 2018-11-27 |
| 10059866 | Epoxy resin compositions and thermal interface materials comprising the same | Yen-Chun Liu, Hui-Wen Chang, Hsiang-Yen TSAO | 2018-08-28 |
| 9780236 | Conductive paste composition and method for manufacturing electrode | Chun-Yi Chiu, Wei-Han Hsiao | 2017-10-03 |
| 9708437 | Resin formulations, resin polymers and composite materials comprising the resin polymers | Kuei-Yi Chuang, Feng-Po Tseng, Lu-Shih Liao | 2017-07-18 |
| 9371233 | Polyamide-imides, graphite films and preparation for the graphite film | Chen-Lung Lin, Yen-Chun Liu, Hui-Wen Chang, Hsien-Lin Hu | 2016-06-21 |
| 9308706 | Graphite oxide-containing resin formulation, composition, and composite thereof | Lu-Shih Liao, Chen-Lung Lin | 2016-04-12 |
| 8911821 | Method for forming nanometer scale dot-shaped materials | Chun-An Lu, Hong-Ching Lin, Szu-Po Huang | 2014-12-16 |
| 8889789 | Low dielectric constant resin formulation, prepolymer, composition, and composite thereof | Lu-Shih Liao | 2014-11-18 |
| 8784697 | Conductive pastes | Jun Chen, Hsin-Mei Chen | 2014-07-22 |
| 8680196 | Halogen-free and phosphorus-free resin formulation and composite materials prepared therefrom | Lu-Shih Liao | 2014-03-25 |
| 8530566 | Electrically insulating and thermally conductive composition and electronic device | Chen-Lung Lin, Meng-Ju Wu | 2013-09-10 |
| 8465675 | Encapsulation material | Min-Tsung Kuan, Ming-Chia Li, Wen-Hsien Wang, Tzong-Ming Lee, Fang-Yao Yeh | 2013-06-18 |
| 8323553 | Method for manufacturing a substrate with surface structure by employing photothermal effect | Tzong-Ming Lee, Ruoh-Huey Uang, Yu Wang, Yi Cheng | 2012-12-04 |
| 8039537 | Modified bismaleimide resins, preparation method thereof and compositions comprising the same | Feng-Po Tseng, Lu-Shih Liao | 2011-10-18 |
| 7662307 | Composition for thermal interface material | Tzong-Ming Lee | 2010-02-16 |