Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11015018 | Resin composition and method for manufacturing thermally conductive material | Yen-Chun Liu, Min Wang, Kuo-Chan Chiou | 2021-05-25 |
| 10059866 | Epoxy resin compositions and thermal interface materials comprising the same | Yen-Chun Liu, Hui-Wen Chang, Kuo-Chan Chiou | 2018-08-28 |