Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9224673 | Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2015-12-29 |
| 9184128 | 3DIC package and methods of forming the same | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2015-11-10 |
| 9082743 | 3DIC packages with heat dissipation structures | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2015-07-14 |
| 9076754 | 3DIC packages with heat sinks attached to heat dissipating rings | Wensen Hung, Szu-Po Huang, Shin-Puu Jeng | 2015-07-07 |
| 8993432 | Test structure and method of testing electrical characteristics of through vias | Shang-Yun Hou, Wei-Cheng Wu, Hsien-Pin Hu, Jung Cheng Ko, Shin-Puu Jeng +1 more | 2015-03-31 |
| 8865521 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu | 2014-10-21 |
| 8519537 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu | 2013-08-27 |
| 6817884 | Multi-I/O-port-41-channel connector | Mao-Hsiung Chen | 2004-11-16 |
| 6698646 | Room temperature gold wire bonding | Soojin Choi, Chun Chan, Johnny Nigos | 2004-03-02 |
| 6191478 | Demountable heat spreader and high reliability flip chip package assembly | — | 2001-02-20 |
| 5585671 | Reliable low thermal resistance package for high power flip clip ICs | Voddarahalli K. Nagesh, Cheng-Cheng Chang, Bahram Afshari, Jacques Leibovitz | 1996-12-17 |
| 5426405 | Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects | Daniel J. Miller, Lewis R. Dove, Vaddoarahalli K. Nagesh | 1995-06-20 |
| 5199165 | Heat pipe-electrical interconnect integration method for chip modules | Robert K. Crawford, Jacques Leibovitz, Daniel J. Miller | 1993-04-06 |
| 5161090 | Heat pipe-electrical interconnect integration for chip modules | Robert K. Crawford, Jacques Leibovitz, Daniel J. Miller | 1992-11-03 |
| 5155661 | Aluminum nitride multi-chip module | Voddarahalli K. Nagesh | 1992-10-13 |