Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916023 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2024-02-27 |
| 10770405 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-09-08 |
| 10707177 | Thermal interface material having different thicknesses in packages | Sung-Hui Huang, Kuan-Yu Huang, Pai Yuan Li, Hsiang-Fan Lee | 2020-07-07 |