Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374602 | Semiconductor structure having through substrate via and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin, Shih-Peng Tai, Kuo-Chung Yee | 2025-07-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374602 | Semiconductor structure having through substrate via and manufacturing method thereof | Wei-Ming Wang, Yu-Hung Lin, Shih-Peng Tai, Kuo-Chung Yee | 2025-07-29 |