Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10312118 | Bonding apparatus and method | Pei-Shan Wu, Ming-Tan Lee, Yu-Lin Wang, Yuh-Sen Chang, Pin-Yi Shin +3 more | 2019-06-04 |
| 10083950 | Die stacking method | Larry Jann, Chih-Chien Chang, Po-Wen Chuang, Ming-I Chiu, Chang-Hsi Lin +1 more | 2018-09-25 |
| 9645627 | Computer stick docking system and power management method thereof | Hsin-Liang Lin, Yu-Lin Hsieh, Chen-Ming Chen, Chia-Jung Fan, Hsin-Yi Cheng | 2017-05-09 |
| 9536814 | Die stacking apparatus and method | Larry Jann, Chih-Chien Chang, Po-Wen Chuang, Ming-I Chiu, Chang-Hsi Lin +1 more | 2017-01-03 |