Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431400 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2025-09-30 |
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12164232 | Method for removing resistor layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Hui-Jung Tsai | 2024-12-10 |
| 12132023 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2024-10-29 |
| 11990383 | Package structure having at least one die with a plurality of taper-shaped die connectors | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2024-05-21 |
| 11848233 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2023-12-19 |
| 11823969 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2023-11-21 |
| 11789366 | Method for removing resist layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Hui-Jung Tsai | 2023-10-17 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11515276 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2022-11-29 |
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Hui-Jung Tsai, De-Yuan Lu, Ming-Tan Lee | 2022-11-29 |
| 11508633 | Package structure having taper-shaped conductive pillar and method of forming thereof | Hung-Jui Kuo, Hui-Jung Tsai, Chia-Wei Wang | 2022-11-22 |
| 11378886 | Method for removing resist layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Hui-Jung Tsai | 2022-07-05 |
| 11289373 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Bor-Rung Su, De-Yuan Lu, Hao-Yi Tsai, Tin-Hao Kuo +1 more | 2022-03-29 |
| 10978412 | Manufacturing method of package structure | Hung-Jui Kuo, Hui-Jung Tsai, Tsao-Lun Chang | 2021-04-13 |
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2019-12-31 |
| 8796071 | Thermal dissipation substrate | YewChung Sermon Wu, Yu Chia Chiu, Jen-Li Hu | 2014-08-05 |