Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12315819 | Method of forming RDLs and structure formed thereof | Hung-Jui Kuo, Chen-Hua Yu, Hui-Jung Tsai | 2025-05-27 |
| 12062603 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2024-08-13 |
| 12020983 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2024-06-25 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11651994 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2023-05-16 |
| 11600574 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Hui-Jung Tsai, Chen-Hua Yu | 2023-03-07 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11527466 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2022-12-13 |
| 11404308 | Semiconductor package and method | Hung-Jui Kuo, Hui-Jung Tsai | 2022-08-02 |
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2021-04-06 |
| 10964591 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2021-03-30 |
| 10892228 | Method of manufacturing conductive feature and method of manufacturing package | Hui-Jung Tsai, Hung-Jui Kuo | 2021-01-12 |
| 10886231 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Hui-Jung Tsai, Chen-Hua Yu | 2021-01-05 |
| 10867874 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo | 2020-12-15 |
| 10840129 | Semiconductor package and method | Hung-Jui Kuo, Hui-Jung Tsai | 2020-11-17 |
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2019-12-31 |
| 10515848 | Semiconductor package and method | Hung-Jui Kuo, Hui-Jung Tsai | 2019-12-24 |
| 10361122 | Processes for reducing leakage and improving adhesion | Hui-Jung Tsai, Hung-Jui Kuo, Chen-Hua Yu | 2019-07-23 |
| 10297551 | Method of manufacturing redistribution circuit structure and method of manufacturing integrated fan-out package | Hui-Jung Tsai, Hung-Jui Kuo | 2019-05-21 |
| 10186462 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kou | 2019-01-22 |