Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2025-08-05 |
| 12362309 | Package structure | Hui-Jung Tsai, Hung-Jui Kuo | 2025-07-15 |
| 12021026 | Package structure and method of fabricating the same | Hung-Jui Kuo, Hui-Jung Tsai | 2024-06-25 |
| 11996381 | Package structure and method of fabricating the same | Hui-Jung Tsai, Hung-Jui Kuo | 2024-05-28 |
| 11756879 | Semiconductor devices and methods of manufacturing the same | Hung-Jui Kuo, Hui-Jung Tsai, Keng-Han Lin | 2023-09-12 |
| 11742317 | Process including a re-etching process for forming a semiconductor structure | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-08-29 |
| 11670582 | Package structure and method of fabricating the same | Hung-Jui Kuo, Hui-Jung Tsai | 2023-06-06 |
| 11587902 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2023-02-21 |
| 11557561 | Package structure and method of fabricating the same | Hui-Jung Tsai, Hung-Jui Kuo | 2023-01-17 |
| 11251121 | Package structure and method of fabricating the same | Hung-Jui Kuo, Hui-Jung Tsai | 2022-02-15 |
| 11127701 | Method of manufacturing intergrated fan-out package with redistribution structure | Hung-Jui Kuo, Hui-Jung Tsai | 2021-09-21 |
| 11088068 | Semiconductor packages and methods of manufacturing the same | Hung-Jui Kuo, Hui-Jung Tsai, Keng-Han Lin | 2021-08-10 |
| 10879161 | Semiconductor packages having a seed layer structure protruding from an edge of metal structure | Hung-Jui Kuo, Hui-Jung Tsai, Chien-Tang Peng | 2020-12-29 |
| 10879199 | Method of manufacturing semiconductor package | Hung-Jui Kuo, Hui-Jung Tsai | 2020-12-29 |
| 10854570 | Integrated fan-out package and method of fabricating the same | Hui-Jung Tsai, Hung-Jui Kuo | 2020-12-01 |
| 10522501 | Semiconductor structure and method of forming the same | Hui-Jung Tsai, Yun Chen Hsieh, Tai-Min Chang, Yi-Yang Lei, Hung-Jui Kuo +1 more | 2019-12-31 |