Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11575006 | Van der Waals integration approach for material integration and device fabrication | Xiangfeng Duan, Yu Huang | 2023-02-07 |
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2022-12-13 |
| 10901243 | Graphene-based semiconductor chip for tunable THz plasmon generation | Chee Wei Wong, Baicheng Yao, Xiangfeng Duan | 2021-01-26 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2020-08-11 |
| 10163836 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2018-12-25 |
| 9875979 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang +8 more | 2018-01-23 |
| 9685559 | Vertically stacked heterostructures including graphene | Xiangfeng Duan, Woojong Yu, Yu Huang | 2017-06-20 |