Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406970 | Semiconductor package and method of bonding workpieces | Bingchien Wu, Chun-Yen Lo | 2025-09-02 |
| 12381191 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Bingchien Wu, Chun-Yen Lo | 2025-08-05 |
| 12337348 | Ultrasonic transducer | Yi-Ting Su, Lung-Hui Chen, Sheng-Yen Tseng, Ming-Chu Chang | 2025-06-24 |
| 12094624 | Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the same | Yue Zhao, Chunjiang Guo, Yue Wu | 2024-09-17 |
| 11908843 | Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package | Bingchien Wu, Chun-Yen Lo | 2024-02-20 |
| 11844289 | Second generation high-temperature superconducting (2G-HTS) tape and fabrication method thereof | Yue Zhao, Chunjiang Guo, Yue Wu, Sikan Chen, Jiamin Zhu +1 more | 2023-12-12 |
| 10414088 | Platform structure for use in low-temperature manufacturing of scaffold for use in tissue engineering and method of low-temperature manufacturing scaffold for use in tissue engineering | Chao-Yaug Liao, Ching-Shiow Tseng, Fang-Chieh Tu, Yen-Sheng Lin | 2019-09-17 |
| 9673053 | Method for fabricating semiconductor device | Rung-Yuan Lee, Yu-Ting Li, Jing-Yin Jhang, Chen-Yi Weng, Jia Fang +8 more | 2017-06-06 |
| 9530871 | Method for fabricating a semiconductor device | Ming-Yueh Tsai, Jia Fang, Yi-Wei Chen, Jing-Yin Jhang, Rung-Yuan Lee +1 more | 2016-12-27 |
| 9443757 | Semiconductor device and method for fabricating the same | Ming-Yueh Tsai, Jia Fang, Yi-Wei Chen, Jing-Yin Jhang, Rung-Yuan Lee +1 more | 2016-09-13 |
| 7172948 | Method to avoid a laser marked area step height | Chin-Kun Fang, Kun-Pi Cheng, Ching-Jiunn Huang, Chung-Jen Chen | 2007-02-06 |
| 6811955 | Method for photoresist development with improved CD | Sung-Cheng Chiu, Ching-Jiunn Huang, Cheng-Ming Wu | 2004-11-02 |
| 5702981 | Method for forming a via in a semiconductor device | Papu D. Maniar, Roc Blumenthal, Jeffrey L. Klein | 1997-12-30 |