Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702981 | Method for forming a via in a semiconductor device | Papu D. Maniar, Jeffrey L. Klein, Wei-Jen Wu | 1997-12-30 |
| 5633199 | Process for fabricating a metallized interconnect structure in a semiconductor device | Robert W. Fiordalice | 1997-05-27 |
| 5444018 | Metallization process for a semiconductor device | Dennis Yost, Thomas D. Bonifield | 1995-08-22 |
| 5100501 | Process for selectively depositing a metal in vias and contacts by using a sacrificial layer | Rebecca J. Gale | 1992-03-31 |
| 4868490 | Method and apparatus for sheet resistance measurement of a wafer during a fabrication process | — | 1989-09-19 |