Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11253919 | Toughened TiAl-based alloy sheet with periodically misaligned through-hole titanium alloy layers and preparation method thereof | Taotao Ai, Hongfeng Dong, Wenhu Li, Xinqiang Yuan, Zhifeng Deng +1 more | 2022-02-22 |
| 6541366 | Method for improving a solder bump adhesion bond to a UBM contact layer | Shih-Ming Chin, Chia-Jen Cheng, Hsiu-Mei Yu | 2003-04-01 |