| 12300677 |
Semiconductor device package including stress buffering layer |
Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more |
2025-05-13 |
| 12218075 |
Package structure |
Cheng-Yuan KUNG, Hsu-Chiang Shih, Hung-Yi Lin |
2025-02-04 |
| 11721678 |
Semiconductor device package including stress buffering layer |
Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more |
2023-08-08 |
| 11031326 |
Wiring structure, electronic device and method for manufacturing the same |
Wen-Hung Huang, Yan Wen CHUNG |
2021-06-08 |
| 11018120 |
Semiconductor device package with stress buffering layer and method for manufacturing the same |
Shih-Yu Wang, I-Ting Lin, Wen-Hung Huang, Yuh-Shan Su, Chih-Cheng Lee +1 more |
2021-05-25 |
| 10643937 |
Wiring structure, electronic device and method for manufacturing the same |
Wen-Hung Huang, Yan Wen CHUNG |
2020-05-05 |
| 10522492 |
Semiconductor package and semiconductor process |
Wen-Hung Huang, Yan Wen CHUNG |
2019-12-31 |