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Mei-Ju Lu, Chang-Yu Lin, Jr-Wei LIN, Chih-Pin Hung |
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Optoelectronic device package and method of manufacturing the same |
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Semiconductor package device method of manufacturing the same |
Chang-Yu Lin, Chieh-Chen Fu |
2025-04-01 |
| 11894354 |
Optoelectronic device package and method of manufacturing the same |
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2024-02-06 |
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Electronic device package and method for manufacturing the same |
Mei-Ju Lu, Chang-Yu Lin, Jr-Wei LIN, Chih-Pin Hung |
2023-12-05 |
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Semiconductor package structure |
Hung-Yi Lin |
2023-11-21 |
| 11183474 |
Electronic device package and method for manufacturing the same |
Mei-Ju Lu, Chang-Yu Lin, Jr-Wei LIN, Chih-Pin Hung |
2021-11-23 |
| 11063013 |
Semiconductor package structure |
Hung-Yi Lin |
2021-07-13 |
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Semiconductor package structure and method for manufacturing the same |
Mei-Ju Lu, Zong-Yu Yang, Pei-Jung YANG |
2021-04-27 |
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Semiconductor package device and method of manufacturing the same |
Chang-Yu Lin, Chieh-Chen Fu |
2021-02-23 |
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Multilayer filter screen and manufacturing method thereof |
Yu-Hsun Fang, Pi-Min Lin |
2020-12-29 |
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Semiconductor device packages |
Yi-Min Chin, Jia-Hao Zhang, Mei-Ju Lu |
2018-01-02 |
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Semiconductor package structure and semiconductor manufacturing process |
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2016-09-13 |
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Semiconductor structure having aperture antenna |
Chi-Tsung Chiu |
2015-10-27 |
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Pao-Nan Lee, Chi-Tsung Chiu, Chien-Hua Chen |
2015-02-24 |
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Silicon wafer having testing pad(s) and method for testing the same |
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2013-08-06 |
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Balun circuit manufactured by integrate passive device process |
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2011-11-01 |
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Transformer with symmetric structure |
Pao-Nan Lee, Ying-Chieh Shyu |
2011-08-30 |
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Balun circuit manufactured by integrate passive device process |
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2011-08-30 |
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Pao-Nan Lee |
2011-04-12 |
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Dual inductance structure |
Ying-Chieh Shyu, Pao-Nan Lee |
2010-10-05 |
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Accessory light |
Mitchell J. Clauw, Jeffrey C. Dennis, Nicholas Novak, George Walczowski |
2009-03-24 |