Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300602 | Semiconductor package structure and method for manufacturing the same | Meng-Wei Hsieh, Teck-Chong Lee | 2025-05-13 |
| 12176259 | Semiconductor package structure | Teck-Chong Lee | 2024-12-24 |
| 11887928 | Package structure with interposer encapsulated by an encapsulant | Sheng-Wen Yang, Teck-Chong Lee, Yen-Liang Huang | 2024-01-30 |
| 11621220 | Assembly structure and method for manufacturing the same | Chih-Pin Hung, Teck-Chong Lee, Chih-Yi Huang | 2023-04-04 |
| 11515241 | Semiconductor device package and method of manufacturing the same | Teck-Chong Lee | 2022-11-29 |
| 11508655 | Semiconductor package structure and method for manufacturing the same | Meng-Wei Hsieh, Teck-Chong Lee | 2022-11-22 |
| 11495572 | Semiconductor package device and method of manufacturing the same | Teck-Chong Lee | 2022-11-08 |
| 11373967 | Semiconductor device package and method for packaging the same | Teck-Chong Lee, Sheng-Wen Yang | 2022-06-28 |
| 11276620 | Package structure and method for manufacturing the same | Teck-Chong Lee | 2022-03-15 |
| 10950531 | Semiconductor device package and method of manufacturing the same | Teck-Chong Lee | 2021-03-16 |
| 10861840 | Integrated passive component and method for manufacturing the same | Teck-Chong Lee, Chien-Hua Chen | 2020-12-08 |
| 10838144 | Semiconductor device packages | Yi-Min Chin, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung | 2020-11-17 |
| 10741523 | Semiconductor package device and method of manufacturing the same | Teck-Chong Lee | 2020-08-11 |
| 10241264 | Semiconductor device packages | Yi-Min Chin, Mei-Ju Lu, Jia-Hao Zhang, Wen-Chi Hung | 2019-03-26 |
| 9929132 | Semiconductor device and process of making the same | Teck-Chong Lee, Chien-Hua Chen, Pao-Nan Lee | 2018-03-27 |
| 9837352 | Semiconductor device and method for manufacturing the same | Chien-Hua Chen, Teck-Chong Lee | 2017-12-05 |
| 9577027 | Semiconductor device and process of making the same | Teck-Chong Lee, Chien-Hua Chen, Pao-Nan Lee | 2017-02-21 |