Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device packages and stacked package assemblies including high density interconnections

Semiconductor device packages and stacked package assemblies including high density interconnections

US Patent 10916429 · Granted Feb 9, 2021

Estimated economic value: $5,568,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device package and method for manufacturing the same2025
Semiconductor package structure and method for manufacturing the same2025
Capacitor structure2025
Package structure and testing method2025
Semiconductor package with integrated voltage regulator device and separate brid2024
Semiconductor device packages and methods of manufacturing the same2024
Semiconductor package structure2024
Electronic device2024
Semiconductor package structure and method for manufacturing the same2024
Package structure and method for manufacturing the same2024
Electronic device2023
Electronic device package and method for manufacturing the same2023