Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119312 | Device package | Cheng-Nan Lin, Wei-Tung CHANG, Huei-Shyong Cho | 2024-10-15 |
| 12087652 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Chang-Lin Yeh | 2024-09-10 |
| 11862544 | Electronic assembly | Chang-Lin Yeh | 2024-01-02 |
| 11705412 | Device package | Cheng-Nan Lin, Wei-Tung CHANG, Huei-Shyong Cho | 2023-07-18 |
| 11462455 | Semiconductor package device and method of manufacturing the same | Shiu-Fang Yen, Chang-Lin Yeh | 2022-10-04 |
| 11410899 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Chang-Lin Yeh | 2022-08-09 |
| 11037891 | Device package | Cheng-Nan Lin, Wei-Tung CHANG, Huei-Shyong Cho | 2021-06-15 |
| 10991656 | Semiconductor device package | Chang-Lin Yeh | 2021-04-27 |
| 10950530 | Semiconductor device package and method of manufacturing the same | Cheng-Nan Lin | 2021-03-16 |
| 10580713 | Semiconductor package device and method of manufacturing the same | Yi-Chi Chen, Chang-Lin Yeh | 2020-03-03 |
| 10381300 | Semiconductor device package including filling mold via | Chang-Lin Yeh, Yi-Chi Chen, Sung-Hung Chiang | 2019-08-13 |
| 10332849 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Chih-Yi Huang, Fu-Chen Chu | 2019-06-25 |
| 10074622 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Chih-Yi Huang, Fu-Chen Chu | 2018-09-11 |
| 8059422 | Thermally enhanced package structure | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu +3 more | 2011-11-15 |
| 7614888 | Flip chip package process | Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu +3 more | 2009-11-10 |
| 7247267 | Mold and method of molding semiconductor devices | Kuo-Chung Yee | 2007-07-24 |
| 7002257 | Optical component package and packaging including an optical component horizontally attached to a substrate | Su Tao, Kuo-Chung Yee | 2006-02-21 |
| 6838762 | Water-level package with bump ring | Su Tao, Kuo-Chung Yee, Chih-Lung Chen, Hsing-Jung Liau | 2005-01-04 |
| 6822324 | Wafer-level package with a cavity and fabricating method thereof | Su Tao, Kuo-Chung Yee, Chih-Lung Chen, Hsing-Jung Liau | 2004-11-23 |
| 6809852 | Microsystem package structure | Su Tao, Kuo-Chung Yee, Chih-Lung Chen, Hsing-Jung Liau | 2004-10-26 |
| 6768207 | Multichip wafer-level package and method for manufacturing the same | Su Tao, Kuo-Chung Yee, Chih-Lung Chen, Hsing-Jung Liau | 2004-07-27 |
| 6693364 | Optical integrated circuit element package and process for making the same | Su Tao, Kuo-Chung Yee, Chih-Lung Chen, Hsing-Jung Liau | 2004-02-17 |